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The SMC research foundry provides services for the microfabrication and MEMS industry, including post processing on commodity CMOS wafers. Access to our comprehensive microelectronics and MEMS toolset, which is support by our highly experienced staff, enables SMC customers to accelerate process and product development. Processes can be flexibly delivered on multiple wafer sizes from 75 to 200mm. The research foundry has tools and technical expertise in the following process areas.
Lithography (contact, proximity double sided, including IR and wafer stepper technology, i and g-line)
Layer deposition (LPCVD, PECVD, ECR)
Metallisation (sputtering and evaporation)
Dry etch (including deep etch)
Wafer to wafer bonding
MEMS dry etch release using XEF2
MEMS surface treatment
CMP - Chemical mechanical polishing (metal, polysilicon and oxides)
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