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assembly


SMC Assembly offers our customers low volume, rapid turn around packaging solutions with wafer dicing, wire bonding and packaging capability. Offered as a highly agile rapid turn around service we enable our customers to move quickly and reliably from design to functional device.

assembly_01_chip assembly_02_onboard assembly_03_sawing

arrow_small Wafer dicing upto 200mm diameter
arrow_small Device packaging eutectic or epoxy die packages
arrow_small Wire bonding:
   - ultrasonic aluminium
   - gold wedge
   - thermasonic gold ball
arrow_small Encapsulation
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The Kings Buildings, West Mains Road, Edinburgh EH9 3JF
Tel: +44 (0)131 650 7474 - Fax: +44 (0)131 650 7475
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